HDTMS-, Polybutadiene-, and Benzotriazole-Modified Polylactic-Based Resin for Solar Cells Encapsulation with Exceptional Environmental Stability of MAPI Perovskite Films

In this work, we report a protective encapsulation intended as the final coating layer on solar cells. The formulation consists of polylactic (PLA)-based resin, modified with hexadecyltrimethoxysilane (HDTMS), epoxidized polybutadiene (EPB), and benzotriazole as a UV absorber with approximate weight fractions ranging from 20 to 60 wt% for PLA, 30-80 wt% for solvents (toluene and chloroform), and 0-5 wt% for HDTM, EPB, and benzotriazole with percentages 54.2%, 29.2%, and 16.7%, respectively. The encapsulating material, due to its insulating nature and high optical transparency, surpasses that of ethylene-vinyl acetate (EVA), as demonstrated in this study. To assess the protective effect of the developed formulation, the study focused on applying the modified PLA resin onto isolated methylammonium lead iodide (MAPI) perovskite films on glass substrates. The samples were prepared as isolated MAPI absorbers to specifically assess the intrinsic contribution of the dual encapsulation configuration at its real position in a complete solar cell stack, demonstrating that even this unoptimized perovskite film exhibits remarkable stability and excellent structural and optical retention over two months under the protective scheme (86% of its initial structural stability, as quantified from integrated XRD peak intensities, and 68% of its initial optical absorbance, determined from the integrated UV-Vis spectra), whereas the uncoated films showed significant degradation. Although MAPI was selected as a model system due to its well-known environmental instability, the proposed encapsulation material and methodology are not limited to this architecture and can, in principle, be applied to various photovoltaic technologies. These findings demonstrate the strong potential of the polylactic-based resin as an effective environmental barrier for solar cells and provide a solid foundation for future full-device integration studies.