A compact and monolithically integrable 140 GHz InP HEMT fundamental mixer using 80-nm T-gate technology for terahertz receiver front-ends

A compact fundamental 140 GHz mixer using our in-house 80 nm T-gate InP HEMT process is designed, fabricated and characterized. A compact resistive topology is designed to enable low power consumption, high conversion gain and high integration. Measurement results show a maximum conversion gain of -9 dB and an IF bandwidth of 15 GHz within the 130 GHz-150 GHz range under a LO power of -1 dBm. The proposed resistive mixer features a compact size of 0.63 mm × 0.9 mm and can be fabricated with InP HEMT LNA on the same wafer. The results demonstrate that the mixer is well suited for integrated terahertz receiver front-ends.

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Publication Details

Journal
IEICE Electronics Express
Published
2026-01-25
DOI
https://doi.org/10.1587/elex.23.20250697
Primary Topic
Superconducting and THz Device Technology
Type
article
Field-Weighted Citation Impact
0.00

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article

A compact and monolithically integrable 140 GHz InP HEMT fundamental mixer using 80-nm T-gate technology for terahertz receiver front-ends

Jiaxing Sun, Yan Su, Yuxuan Chen, Tong Liu et al.
IEICE Electronics Express
Superconducting and THz Device Technology
article

A compact and monolithically integrable 140 GHz InP HEMT fundamental mixer using 80-nm T-gate technology for terahertz receiver front-ends

Jiaxing Sun, Yan Su, Yuxuan Chen, Tong Liu, Siyuan Liu, Changqing Zhang, Peng Ding, Xu Han, Y.-J. Gong, Feng Yang, Zhi Jin, Yong Zhang, Haomiao Wei, Dayong Zhang, Jingyuan Shi, Yifei Xie
article en

Abstract

A compact fundamental 140 GHz mixer using our in-house 80 nm T-gate InP HEMT process is designed, fabricated and characterized. A compact resistive topology is designed to enable low power consumption, high conversion gain and high integration. Measurement results show a maximum conversion gain of -9 dB and an IF bandwidth of 15 GHz within the 130 GHz-150 GHz range under a LO power of -1 dBm. The proposed resistive mixer features a compact size of 0.63 mm × 0.9 mm and can be fabricated with InP HEMT LNA on the same wafer. The results demonstrate that the mixer is well suited for integrated terahertz receiver front-ends.

IEICE Electronics ExpressVol. 23(6)
University of Electronic Science and Technology of China (CN), Dongguan University of Technology (CN), Institute of Microelectronics (SG), University of Chinese Academy of Sciences (CN)
National Natural Science Foundation of China
Affordable and clean energy
Openalex Percentile: Top 75%
Superconducting and THz Device Technology
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