STUDIES ON THE ANALYSIS OF THE STATE OF STRESSES AND DEFORMATIONS OF THE DIE FIXING SYSTEM USED IN WIRE DRAWING IN AN ULTRASONIC FIELD EXPERIMENTS

Wire drawing is the technological process of obtaining wires by passing the semi-finished product through the inside of a mold. This technology is a classic one and is carried out in the same way regardless of the production system and regardless of the manufacturer. The wire drawing process takes place through the plastic deformation of the material due to the friction process that takes place between the mold and the semi-finished product. The friction process is very important and hence the substantial energy consumption. The use of the ultrasonic vibration field applied to the mold can lead to a substantial reduction in friction, thus being particularly useful. To prove this very important property, an experimental stand was created in which the mold was introduced into a manufactured support, in this case by 3D printing. The use of this additive manufacturing method is very important and relatively easy to apply. The problem encountered in this case is to determine whether this support can support the wire drawing process, so further tests are necessary to analyze the state of stresses and deformations that occur during the wire drawing process. In this article, the designed support and the analysis of its behavior under the action of the drawing force are presented.