Mechanically Robust and Anisotropically Thermal Conductive Nacre‐Like Composite Enabled by Continuous Layered Ceramic Scaffold

ABSTRACT With ever‐increasing demands for integration and portability, advanced electronic devices are gradually developing toward miniaturization and lightweight. Thus, materials, with the combination of robust mechanical properties for load support and high thermal conductivity for heat dissipation, are highly desired yet challenging as substrate materials for electronic devices. Here, we fabricated a continuous nacre‐like composite with dual‐interface via a scalable bottom‐up assembly strategy. Relying on a dual‐interface design, provided by mineral bridges enabled layered ceramic scaffolds (ceramic–ceramic) for strong interface and brick‐and‐mortar structure (resin–ceramic) for weak interface, the obtained continuous nacre‐like composites exhibit synergistic enhancement of both mechanical properties and thermal conductivity. Besides, such a dual‐interface design guarantees that these performances can be maintained at a high level under elevated temperature (100°C). This achieved integration of mechanical and thermal properties shows superiorities compared with that of most commonly‐used electronic substrate materials, making this continuous nacre‐like composite a promising candidate as substrate materials for electronic fields.