Sustainable Heatsink Optimization for Multi-Component PC enclosure

Overheating is a significant challenge for the widespread use of desktop personal computers (PCs). This thermal issue frequently results in operational failures and poses safety risks. While current thermal optimization often relies on integrating a single heatsink (such as on the Central Processing Unit or CPU), research indicates this approach is insufficient for effectively lowering the machine's overall maximum temperature (Tmax). To address this critical gap, this study introduces a novel passive multi-heatsink thermal solution. Utilizing Computational Fluid Dynamics (CFD) simulation, the research analyzes the strategic placement and performance of multiple generic heatsinks on various major heat-generating components inside the PC enclosure. The simulation successfully determined the optimum number and configuration of these components, verifying that distributing multiple passive heatsinks is a viable and effective method for significantly reducing the device's maximum operating temperature Tmax.