Concurrent In Situ High-Resolution Electron Backscatter Diffraction and Digital Image Correlation for Full-Field Stress-Strain

Experimental full-field stress and strain data are a valuable resource to quantify microscale material response and crystal plasticity. Such data are highly effective for calibration and validation of crystal plasticity models. Methods for acquiring such data exist in digital image correlation (DIC) and high-resolution electron backscatter diffraction (HREBSD) to calculate strain and stress, respectively, but are difficult to combine over a concurrent domain due to EBSD being incompatible with typical DIC surface preparation. In this work, microstamping is used to apply EBSD-compatible selective-electron-transparent DIC speckling to an additively manufactured polycrystalline Ni superalloy. Both data modalities are collected during in situ loading over the same region without the need to remove or reapply speckling.