Fluorine‐Rich Poly(aryl ether) Photosensitive Resins Enable Thermal‐ and Moisture‐Resilient 3D Conformal Electronics With a High‐Frequency Antenna Demonstration

ABSTRACT With the advancement of the Internet of Things (IoT), 3D printing has emerged as a versatile fabrication platform for constructing 3D conformal electronics. However, developing photosensitive resins compatible with 3D printing that possess high thermal and moisture stability alongside low dielectric loss remains a challenge for fabricating complex, curved 3D circuits. Herein, a fluorine‐rich poly(aryl ether) photosensitive material system, synthesized via quaternary copolymerization and blended with thiols to formulate inks for direct ink writing (DIW) is presented. The optimized inks demonstrate high thermal stability (glass transition temperature up to 247°C), robust mechanical strength (tensile strength of 69 MPa and elongation at break of 17%), and favorable dielectric properties (dielectric constant of 2.86 and dielectric loss of 0.0063 at 10 GHz). Leveraging the advantageous properties of the poly(aryl ether) photosensitive inks, it is successfully fabricated various functional, complex 3D structures with high thermal and moisture stability, including high‐curvature conformal circuits. Furthermore, a 3D‐printed high‐frequency X‐band antenna operating at 10.2 GHz, highlighting the practical applications of these fluorine‐rich resin materials for advanced IoT devices is demonstrated. These results present a promising material concept and fabrication strategy for producing complex 3D‐printed circuits applicable to a wide range of 3D conformal electronic devices.