Comparative Performance Analysis of Screen-Printed Structures on Polyethylene Terephthalate and BPET Substrates Utilizing Low-Temperature Electrically Conductive Adhesive and MACA for Surface Mount Device Component Attachment

Abstract Polyethylene terephthalate (PET) and polymide (PI) are used for the additive fabrication of flexible hybrid electronics (FHE) due to their excellent thermal and dimensional stability and mechanical strength. However, their environmental impact is high due to minimal degradation even after decades in landfills. There is a growing global push for sustainable solutions for printed electronics. Recent studies indicate that alternatives, such as biobased PET, polylactic acid, and regenerated cellulose film, all derived from renewable resources, may not only match but, in some instances, surpass the performance of traditional PET. While these materials show promise in certain environments, comprehensive research on their adaptability across various conditions remains inadequate. With the escalating demand for electronics in diverse areas, ranging from packaging to healthcare, it becomes crucial to thoroughly evaluate the efficiency, longevity, and versatility of these renewable substrates. This research addresses these concerns, focusing on assessing the performance of biobased PET substrates in FHE applications and comparing their performance with that of traditional PET substrates. Research Objectives include: (a) To understand the significance of Flexible Hybrid Electronics in the context of sustainable and environmentally friendly electronics. (b) To determine the compatibility and performance of the biodegradable PET substrate during the screen-printing process, especially while printing with water-based inks. (c) To test the performance of printed circuits and calculate the error percentage between the actual and simulated performance.