Copper Functional Layer in Low-Emissivity Coating Technology

This work examines the characteristics of low-emissivity copper-based coatings with a TiO2/Cu/TiO2 structure deposited by magnetron sputtering on glass substrates. The goal of the study is to optimize the deposition parameters to achieve high light transmittance and coating adhesion. It has been found that the sample with the shortest deposition time copper (4 s) and titanium sublayer (20 s) demonstrates the best results, meeting the requirements of GOST 31364-2007. The coating adhesion exceeded the glass strength (20.4 kg/cm3), confirming its high stability. These results have implications for energy-efficient building construction and the development of transparent thermal insulation materials.