Surface modification by chlorine-chemistry during atomic layer etching of aluminum nitride: A first principles-based analysis

Using first-principles density functional theory calculations in combination with the climbing-image nudged elastic band method, we investigated the adsorption, desorption, and diffusion of atomic chlorine (Cl) and molecular chlorine (Cl2) on the Al-terminated 0001 surface of aluminum nitride (AlN). Our results reveal that both atomic Cl and Cl2 exhibit a chemisorption character with high binding energies. Calculations revealed that the splitting pathway of Cl2 on the Al-terminated AlN 0001 surface is a barrierless and exothermic process. These findings provide new microscopic-scale insights into halogen-insulator surface interactions and opportunities for new strategies in optimizing the AlN atomic layer etching process in semiconductor fabrication.

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Publication Details

Journal
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
Published
2026-01-09
DOI
https://doi.org/10.1116/6.0004975
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00
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article

Surface modification by chlorine-chemistry during atomic layer etching of aluminum nitride: A first principles-based analysis

Nikolai Andrianov, Thomas Gruhn, Joaquín Miranda, Sanjay Nayak
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
GaN-based semiconductor devices and materials
article

Surface modification by chlorine-chemistry during atomic layer etching of aluminum nitride: A first principles-based analysis

Nikolai Andrianov, Thomas Gruhn, Joaquín Miranda, Sanjay Nayak
article en

Abstract

Using first-principles density functional theory calculations in combination with the climbing-image nudged elastic band method, we investigated the adsorption, desorption, and diffusion of atomic chlorine (Cl) and molecular chlorine (Cl2) on the Al-terminated 0001 surface of aluminum nitride (AlN). Our results reveal that both atomic Cl and Cl2 exhibit a chemisorption character with high binding energies. Calculations revealed that the splitting pathway of Cl2 on the Al-terminated AlN 0001 surface is a barrierless and exothermic process. These findings provide new microscopic-scale insights into halogen-insulator surface interactions and opportunities for new strategies in optimizing the AlN atomic layer etching process in semiconductor fabrication.

Journal of Vacuum Science & Technology A Vacuum Surfaces and FilmsVol. 44(2)
Silicon Austria Labs (Austria) (AT), University of Bayreuth (DE)
Openalex Percentile: Top 89%
GaN-based semiconductor devices and materials
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Surface modification by chlorine-chemistry during atomic layer etching of aluminum nitride: A first principles-based analysis — Nikolai Andrianov, Thomas Gruhn, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (2026) | TGRS Research Map | TGRS