Impact of Microplastics on Copper Electrodeposition: Morphological and Electrochemical Insights

Microplastics (MPs) have been attracting considerable interest in recent years due to their ubiquitous existence and accumulation within different systems and ecosystems. Moreover, their presence in electroplating baths involves a more serious challenge considering that the electroplating industry is progressing towards the electroplating of plastic materials. Contaminated baths can lead to surface defects, poor adhesion, corrosion, and inconsistent deposit thicknesses. Despite these issues, the interactions between pollutant MPs and heavy metal ions in electroplating environments are still underexplored. The present study aims to investigate the behavior of self-produced “Nylon PA” MPs dispersed in acid copper electroplating baths and their interactions with copper ions in solution. Scanning electron microscopy (SEM) reveals several surface defects in copper deposits caused by MPs in the bath. Additionally, cyclic voltammetry and chronoamperometry indicate significant changes in nucleation and growth mechanisms, with MPs showing suppressant-like effects on copper deposition. These results shed light on the impact of MPs on copper electrodeposition, emphasizing the urgent need for further research and mitigation strategies to address this emerging issue in the electroplating industry.