A review of microfluidic technologies for thermal management in flexible electronics

Flexible electronics with the features of soft, ultrathin, and shape adaptable properties, are believed as next-generation devices for physiological monitoring, digital diagnostics, and human-computer interaction. With the development of devices towards miniaturization and integration, thermal management has emerged as an essential challenge, which not only influences device performance and long-term stability but also affects user comfort. Various thermal management strategies, including passive and active approaches, have been employed to regulate the operating temperature. Nevertheless, it is still challenging to develop thermal regulation systems with a large temperature regulation range, good temperature uniformity, and high mechanical flexibility. Recently, the microfluidics-based thermal regulation method has emerged as a promising method that integrates active and passive thermoregulation methods. This review explores the thermal management mechanisms enabled by microfluidic devices, emphasizing an integrated strategy that combines material selection, structural geometry, and system optimization to enhance thermal performance. We analyze heat transfer principles in microchannels and highlight applications in device-level thermal management, personal thermal regulation, and thermal regulation interface for human-machine interaction and healthcare, addressing their specific demands. Finally, we outline the challenges and future perspectives for advancing microfluidics-based thermal management systems, focusing on capability, integration, and applications.

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Publication Details

Journal
Lab on a Chip
Published
2026-01-01
DOI
https://doi.org/10.1039/d5lc00906e
Primary Topic
Thermal properties of materials
Type
article
Field-Weighted Citation Impact
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article

A review of microfluidic technologies for thermal management in flexible electronics

Xinge Yu, Jie Sun, Mingzi Liu, J. C. Li et al.
Lab on a Chip
Thermal properties of materials
article

A review of microfluidic technologies for thermal management in flexible electronics

Xinge Yu, Jie Sun, Mingzi Liu, J. C. Li, Zuowei Sun, Yi Xiao, Yi Chen
article en

Abstract

Flexible electronics with the features of soft, ultrathin, and shape adaptable properties, are believed as next-generation devices for physiological monitoring, digital diagnostics, and human-computer interaction. With the development of devices towards miniaturization and integration, thermal management has emerged as an essential challenge, which not only influences device performance and long-term stability but also affects user comfort. Various thermal management strategies, including passive and active approaches, have been employed to regulate the operating temperature. Nevertheless, it is still challenging to develop thermal regulation systems with a large temperature regulation range, good temperature uniformity, and high mechanical flexibility. Recently, the microfluidics-based thermal regulation method has emerged as a promising method that integrates active and passive thermoregulation methods. This review explores the thermal management mechanisms enabled by microfluidic devices, emphasizing an integrated strategy that combines material selection, structural geometry, and system optimization to enhance thermal performance. We analyze heat transfer principles in microchannels and highlight applications in device-level thermal management, personal thermal regulation, and thermal regulation interface for human-machine interaction and healthcare, addressing their specific demands. Finally, we outline the challenges and future perspectives for advancing microfluidics-based thermal management systems, focusing on capability, integration, and applications.

Lab on a ChipVol. 26(5)
Sun Yat-sen University (CN), City University of Hong Kong (HK), Sichuan University (CN), Hong Kong Science and Technology Parks Corporation (HK), Science and Technology Department of Sichuan Province (CN)
Openalex Percentile: Top 94%
Thermal properties of materials
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