Concepts for a cost-efficient, additively manufactured WR90 coaxial waveguide transition

Abstract. This publication focuses on the production of low-cost prototypes of coaxial-waveguide transitions (CWTs) that achieve the performance level of industrial WR90 and WR187 CWTs. The assembly consists of a specially designed coupling element in stripline technology that merges into an SMA connector. It is embedded into a 3D printed housing treated with a metallic surface finishing to achieve compatibility with hollow waveguides. In the first part of this study, a copper spray varnish is used to create a conductive surface on the device under test (DUT). After assembly of the prototypes, network parameters will be extracted for one pair of transitions by carrying out a set of 2-port measurements. The individual performance of a singular DUT is then deembedded by using reference measurements of commercial-grade waveguides. This analysis shows that also S-parameter extraction on connectors with a poor transition is valid. Subsequently, the procedure for the developed WR90 CWT is applied to a WR187 waveguide standard, again followed by a performance analysis. The procedure briefly addresses the modified parameters and illustrates the results as S-parameters. A comparative analysis of the measurement results for each deembedded WR90 and WR187 prototype respectively, indicates a better performance for larger waveguide standards. In consistency with this observation, larger relative tolerances in manufacturing and difficulties in controlling a uniform metallization process are identified as the limiting factors of miniaturization. In the second part of this work, an alternative concept utilizing aluminum coating and a segmented manufacturing approach is developed, targeting reduced insertion loss but keeping the mechanical tolerance level. The redesign is based on the geometry of the prior WR90 prototype, but forming a plug-in kit with each body segment being clad in multiple thin layers of aluminum foil. The measurement results of these samples reveal the effects of increased conductivity and reduced irregularities in terms of significantly improved reflection and transmission parameters. The DUTs investigated in the third part of this work again originate from the initially manufactured variants. To investigate the effects of different metallic coatings, the copper varnish is now replaced by a silver based ink, which provides high conductivity and is therefore commonly used in additive manufacturing. The network measurements are repeatedly carried out with a varying number of layers of lacquer applications on the body's surface. By deembedding a singular part from the measurements, it is shown that increasing surface conductivity leads to a significant impact on transmission parameters. In direct comparison, the silver coated CWT outperforms both preceding variants with copper varnish or aluminum clad. With more than 95 % transmitted power, it is indeed competitive compared to the industrially manufactured WR90 CWT reference. To conclude, the study focuses on a comparison of three different additive manufacturing processes for equal hollow waveguide geometries at moderate frequencies. It proves that CWT parts are producible in a simple and rapid process. The production stages with the strongest impact on performance are identified and demonstrated to be controllable. The variant presented finally is able to achieve competitive performance compared to commercial-grade parts, especially when considering the enormous cost reduction. In addition, it is proven that the RF parameter extraction method for symmetric two-port networks presented earlier by the authors is also applicable when the DUT exhibits high insertion losses. The central aim of this work is to demonstrate that additive manufacturing combined with low-cost metallization techniques can produce coaxial-waveguide transitions that approach the performance of industrial WR90 standards. This novelty highlights the feasibility of achieving near-commercial-grade quality at a fraction of the cost, thereby extending the accessibility of high-frequency components to research and prototyping applications.