Large-scale diffusion bonding of aluminium alloy without interlayers: Mechanical performance and interface quality
Genuine diffusion bonding (DB) of aluminium alloys on a practically usable scale has yet to be fully demonstrated for industrial applications. This study presents the successful fabrication of large-sized DB samples of AA6061 aluminium alloy without interlayers and evaluates the mechanical integrity of the bonded interfaces through tensile and shear tests. Notably, tensile testing – seldom performed in previous literature due to limited sample dimensions – was conducted on specimens extracted from the diffusion-bonded assemblies. The results reveal that under optimised process conditions, the bonded interface can attain mechanical performance comparable to the monolithic parent alloy, indicating near-100% bonding efficiency.
Authors
- Jiann Lin Chen
- Shu-Han Hsu (ORCID: https://orcid.org/0000-0002-3014-2013)
- W. Lin
- Da-Wei Liu
- Yuan-Ting Lin
- Shyong Lee
- Chun-Lin Chu
Institutions
- Thammasat University (TH)
- National Health Research Institutes (TW)
- National Central University (TW)
- Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
- I-Shou University (TW)
Publication Details
- Journal
- Science and Technology of Welding & Joining
- Published
- 2026-01-05
- DOI
- https://doi.org/10.1177/13621718251405031
- Primary Topic
- Aluminum Alloys Composites Properties
- Type
- article
- Field-Weighted Citation Impact
- 0.00