Peeling behavior of two-dimensional kirigami materials on substrates at the nanoscale

The combination of two-dimensional materials and substrates has been widely utilized in electronic devices, nano-electromechanical systems, bionic structures, and other applications. However, the interfacial behavior of two-dimensional kirigami materials on substrates remains poorly understood, significantly hindering the design and fabrication of various functional devices. In this study, the peeling behavior of two-dimensional kirigami materials from substrates is investigated through molecular simulations and theoretical analysis. The proposed method proves effective in evaluating the interfacial energy of film/substrate systems with kirigami structures. Moreover, the peeling behavior can be well modulated by adjusting the corresponding cutting parameters. Appropriate design of the kirigami structure can lead to unique interfacial properties, such as directionally dependent peeling responses. The findings provide important insights into the blooming applications of two-dimensional materials and derivations in various high-tech fields and improve the knowledge of surface/interface mechanics.