Deep Strain-Mediated Thermal Transport in Silicon Nanowires
The ability to tune thermal transport through strain engineering offers transformative potential for advanced nanodevices, yet the impact of deep elastic strains (>5%) remains largely unexplored due to challenges in experimental implementation. Here we address this gap by developing a MEMS-based platform to probe strain-thermal transport coupling in suspended silicon nanowires. Through applying uniaxial tensile strains up to 5.65%, we observed three distinct regimes: thermal conductivity remains stable below 1% strain, shows slight enhancement before ∼3% strain, then undergoes a dramatic 55% suppression at 5.65% strain, the largest reversible modulation reported in silicon nanostructures. First-principles calculations reveal that the complex interplay between strain-induced phonon group velocity enhancement, scattering rates, and phonon-phonon interactions modulation is the main contributing factor to the nonmonotonic behaviors. This work establishes deep elastic strain as a powerful knob for dynamically controlling thermal transport, with immediate implications for adaptive thermal management in nanoelectronics and high-efficiency thermoelectrics.
Authors
- Zhentao Pang (ORCID: https://orcid.org/0009-0007-3221-1311)
- Weiye Nie
- Wencong Shi (ORCID: https://orcid.org/0000-0002-7925-0584)
- Y. L. Li
- Baoming Wang
- Yu Deng
- Wenwu Cao
Institutions
- Northwestern Polytechnical University (CN)
- Intelligent Systems Research (United States) (US)
- Collaborative Innovation Center of Advanced Microstructures (CN)
- Nanjing University (CN)
Publication Details
- Journal
- Nano Letters
- Published
- 2025-12-30
- DOI
- https://doi.org/10.1021/acs.nanolett.5c06071
- Primary Topic
- Thermal properties of materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00