Deformation Behavior of Sintered Cu-10wt%Mo Composite in the Hot Extrusion Process

A hot extrusion deformation test of sintered Cu-10wt%Mo composite was carried out under deformation conditions, with deformation temperatures ranging from 800 °C to 950 °C, and extrusion ratios ranging from 2.9 to 10.5. The hot extrusion process eliminated the original interfaces between copper powder particles in sintered Cu-10wt%Mo composite. While the copper phase experienced dynamic recrystallization, the molybdenum particles effectively pinned the boundaries and inhibited subsequent grain growth. As the extrusion ratio increased, the composite material’s tensile strength, elongation, and thermal conductivity first increased and then decreased. With the rise in hot extrusion deformation temperature, the composite material’s tensile strength, elongation, and thermal conductivity gradually increased, but stabilized after reaching 900 °C. Deformation during hot extrusion is confined to the copper phase, which undergoes dynamic recrystallization (DRX), with no significant deformation occurring in the molybdenum phase. The molybdenum phase promotes an increased local strain rate in the copper phase, resulting in the formation of a certain number of twin grains.