System-level simulation of antimonide focal plane arrays

A comprehensive multiphysics simulation framework was developed to systematically assess the key performance metrics of antimonide-based infrared detectors across various pixel structures and operating conditions. The study focuses on modulation transfer function (MTF), optical and electrical crosstalk, and noise equivalent temperature difference (NETD). Simulation results reveal that lateral carrier diffusion is the dominant factor contributing to MTF degradation. Moreover, parameters such as fill factor, bias voltage, pixel size, and integration time exhibit complex interdependencies that significantly affect overall device performance. The analysis further highlights the intricate interplay between structural design and thermal noise constraints, which is especially pronounced in dual-band detectors. This work provides a systematic understanding of the intrinsic influence of structural parameters on detector performance and offers theoretical guidance for the miniaturization and high-performance integration of antimonide-based infrared focal plane arrays.

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Publication Details

Journal
Chip
Published
2025-12-01
DOI
https://doi.org/10.1016/j.chip.2025.100186
Primary Topic
Advanced Semiconductor Detectors and Materials
Type
article
Field-Weighted Citation Impact
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article

System-level simulation of antimonide focal plane arrays

Dongmei Li, Hongyue Hao, Chuanbo Li, Zhigang Song et al.
Chip
Advanced Semiconductor Detectors and Materials
article

System-level simulation of antimonide focal plane arrays

Dongmei Li, Hongyue Hao, Chuanbo Li, Zhigang Song, Xiang Li, Ming Liu, Zhongxian Wang
article en

Abstract

A comprehensive multiphysics simulation framework was developed to systematically assess the key performance metrics of antimonide-based infrared detectors across various pixel structures and operating conditions. The study focuses on modulation transfer function (MTF), optical and electrical crosstalk, and noise equivalent temperature difference (NETD). Simulation results reveal that lateral carrier diffusion is the dominant factor contributing to MTF degradation. Moreover, parameters such as fill factor, bias voltage, pixel size, and integration time exhibit complex interdependencies that significantly affect overall device performance. The analysis further highlights the intricate interplay between structural design and thermal noise constraints, which is especially pronounced in dual-band detectors. This work provides a systematic understanding of the intrinsic influence of structural parameters on detector performance and offers theoretical guidance for the miniaturization and high-performance integration of antimonide-based infrared focal plane arrays.

Chip
Beijing University of Posts and Telecommunications (CN), Minzu University of China (CN), Chinese Academy of Sciences (CN), Institute of Semiconductors (CN), North China Research Institute of Electro-optics (CN)
Openalex Percentile: Top 41%
Advanced Semiconductor Detectors and Materials
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System-level simulation of antimonide focal plane arrays — Dongmei Li, Hongyue Hao, et al. · Chip (2025) | TGRS Research Map | TGRS