Impedance matching optimization design for high speed connectors

To address signal degradation in existing connectors during high-speed transmission due to dielectric and conductor losses, this study proposes an optimization design method targeting the connector structure and materials. First, a three-dimensional deformation model of the connector under operational conditions is obtained through mechanical simulation, serving as the basis for signal integrity analysis. Second, the connector is divided into A/B regions based on differing link relationships. Using TDR impedance, S-parameters, and COM values as evaluation metrics, the differential signal transmission performance is optimized. By refining the substrate material and air gap structure, the impedance in regions A and B is brought closer to the target value of 100 Ω. Optimizing the mating structure and housing material further improves impedance matching and significantly reduces insertion loss. This solution provides a reliable connector option for high-speed communication equipment and high-performance computing systems.