Influence of Substructural and Solid-Solution Strengthenings on the Formation of a Defect Structure in Cu–Al and Cu–Mn Alloys
The paper presents the results of studying the types of dislocation structures in polycrystalline Cu–Al and Cu–Mn alloys with different additives of the second element. The quantitative parameters of these structures were investigated at different degrees of deformation. The transmission electron microscopy (TEM) data are reported. Alloys of homogeneous solid solutions with different solid-solution strengthening were investigated. The role of the average scalar dislocation density is determined. The following parameters of the dislocation substructure were measured: the values of dislocation density in walls and in cells, the sizes of cells, and the width of their walls. The relationship between the dislocation structure parameters and the value of solid-solution strengthening during the accumulation of dislocations in the material after plastic deformation is established.
Authors
- V. I. Borodin
- T. V. Cherkasova
- A. A. Klopotov
- A. I. Potekaev
- L. I. Trishkina
Institutions
- Tomsk State University of Architecture and Building (RU)
- National Research Tomsk State University (RU)
- Tomsk Polytechnic University (RU)
- Siberian Research Institute of Agriculture and Peat (RU)
- Tomsk National Research Medical Center (RU)
Publication Details
- Journal
- Crystallography Reports
- Published
- 2025-12-01
- DOI
- https://doi.org/10.1134/s1063774525600905
- Primary Topic
- Microstructure and mechanical properties
- Type
- article
- Field-Weighted Citation Impact
- 0.00