Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks

Background: Electromagnetic compatibility (EMC) challenges in 2.5D/3D semiconductor packaging arise from the complex coupling between device, interposer, board, and cable domains, which are insufficiently captured by conventional board-level analysis. Method: This study proposes HiPAC-EMC, a packaging-aware EMC workflow that integrates the device, package, PCB, cable harness, line impedance stabilization network (LISN), and receiver elements into an isomorphic co-model. The model mirrors the entire measurement chain and links simulation to real conducted and radiated tests. Validation: The workflow was verified using CISPR-25-compliant conducted measurements, magnetic near-field mapping, and key-point radiated checks at 3 m and 10 m, ensuring model–measurement consistency within ±2–3 dB (1σ ≈ 3.1 dB). Results: Two quantitative indices—the mitigation efficiency (η) and the common-mode hot-spot headroom (CMH)—enabled the traceable evaluation of suppression effectiveness, achieving up to 22–25 dB reduction across dominant 300–800 MHz bands. Significance: The HiPAC-EMC workflow establishes a traceable, reproducible, and measurement-faithful design methodology, providing a practical tool to de-risk EMC during early design and reduce full-band chamber time for advanced semiconductor packaging.