Thermal Management in <scp>3D</scp> Network on Chip Using Modified <scp>XYZ</scp> Routing Algorithm

ABSTRACT The rapidly developing field of 3D integrated circuit technology offers a revolutionary solution to the increasing number of transistors on a chip: stacking numerous silicon layers vertically. Stacking layers greatly lowers latency and energy usage in 3D integration. Unlike the conventional 2D NoC, the three‐dimensional Network‐on‐Chip (NoC) paradigm offers a multitude of options and difficulties, piquing researchers' attention. For 3D NoC systems, thermal control is a more important consideration than for 2D ones. This research presents an effective XYZ routing method for thermal control. The suggested approach uses a signal produced by a basic controller to dynamically modify traffic flow. By adjusting the XYZ routing technique, this signal prolongs the life of the device by preventing thermal hotspots in the 3D NoC layers. Experimental results show that the suggested method can reduce layer temperatures while preserving performance levels comparable to the original XYZ routing algorithm in comparison to earlier efforts. Utilizing VHDL to construct the design, the 3D NoC design also demonstrates an improvement in space efficiency by requiring fewer LUTs on the FPGA than previous designs.