Effects of SiC Particle Size on SiCp/Al Composite During Vacuum Hot Pressing

High-performance SiC_p/Al composites were fabricated via a vacuum hot-pressing powder metallurgy process. The effects of SiC particle size on the composite microstructures and their thermal and mechanical properties were systematically investigated. The vacuum hot-pressed SiC_p/Al composites exhibited a well-bonded interface between the SiC particles and Al matrix, while not exhibiting any Al₄C₃ brittle phase. Particle gradation effectively enhanced the densification of SiC_p/Al composites, resulting in dense bulks with a relative density of 99.7%. When the SiC particle size increased from 5 to 50 μm, the fracture morphologies gradually transitioned from intergranular to transgranular, while the relative density, bending strength, and thermal conductivity increased. Overall, SiC_p/Al composites with excellent thermal conductivity (201.42 W/(m·K)) and bending strength (523 ± 29.45 MPa) were obtained. To address the scarcity of research on SiC_p/Al composites' thermal properties, this study establishes SiC size/gradation-property relationships, innovatively filling the gap in thermal performance regulation.