Ultra‐Thin Soft Pneumatic Actuation for Minimally Invasive Neural Interfacing
ABSTRACT Soft‐robotic fluidic actuation allows dynamic control of the shape and position of ultra‐flexible bioelectronic implants inside the body. While several actuation approaches have been proposed, all face significant limitations preventing clinical translation. Here, the use of laser‐based fabrication techniques for selective welding of Parylene C to create fluidic actuation chambers capable of withstanding high pressures over repeated actuations is explored. The ultra‐thin Parylene C fluidic chamber design with an electrode array for peripheral nerve interfacing is integrated, serving as a proof‐of‐concept for Parylene C‐only fluidic actuation. Through thermoforming, it is molds Parylene C into a cuff which straightens and stiffens under fluidic pressure to aid implantation, before wrapping around the nerve bundle during depressurization. This is demonstrated on the sciatic nerve of a rodent model, achieving good electrophysiological recording resolution due to the conformal wrapping of the cuff. With the development of ultra‐thin Parylene C based fluidic systems, it is aimed to push the boundaries of bioelectronic systems, offering new possibilities for monolithically integrated, minimally invasive interfacing.
Authors
- Lawrence Coles (ORCID: https://orcid.org/0000-0002-4288-9691)
- Christopher M. Proctor (ORCID: https://orcid.org/0000-0002-2066-1354)
- George G. Malliaras (ORCID: https://orcid.org/0000-0002-4582-8501)
- Carnicer Lombarte Alejandro
- Joe G. Troughton
Institutions
- University of Cambridge (GB)
- Science Oxford (GB)
Publication Details
- Journal
- Advanced Materials Technologies
- Published
- 2025-12-25
- DOI
- https://doi.org/10.1002/admt.202502125
- Primary Topic
- Neuroscience and Neural Engineering
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Institute for Health and Care Research
- Directorate for Biological Sciences
- Engineering and Physical Sciences Research Council
- Invention for Innovation