Nano Copper Metal Electrodeposited on Mild Steel From Dissolved Hydrated Copper Chloride in Deep Eutectic Solvent

In this study, electrodeposition of copper nanoparticles from its soluble hydrated chloride salt in ammonium Alum: urea deep eutectic solvent (DES) of 1:5 mole ratio was investigated. The electrochemical reduction of the Cu (II)/Cu (0) couple was found to be a quasi-reversible reaction, with a broad reduction peak at –0.2 V as revealed by cyclic voltammetry. The hydrated copper chloride stabilized the electro-reduction process within the DES. Scanning electronic microscope (SEM) showed copper metal was electroplated as nano particles 35 to 49 nm agglomerated as Cauliflower on mild steel. Energy dispersive X-ray spectrometry (EDX) X-ray, analyses (XRD) and visually showed the brown smooth good adhesive layer of copper on mild steel substrate. The analysis of atomic force microscopy analysis (AFM) indicates a roughness value (Ra) of 17.58 nm of 789.6 nm calculated average height. X-ray diffraction measurement indicated the brown smooth deposited layers to be pure crystalline Cu structures with crystallographic orientation at Cu (111), Cu (200) and Cu (220). These findings demonstrate the effectiveness of using ammonium alum DES for the electrodeposition of high-quality copper coatings.