Phase formation and crystallographic relationships in Cu–30 at%Zn//Cu–80 at%Zn diffusion couples
The phase formation in binary Cu–30 at.%Zn//Cu–80 at.%Zn diffusion couples annealed at 565°C is investigated by means of electron backscatter diffraction and energy-dispersive x-ray spectroscopy. Growth kinetics and crystallographic relationships of the forming intermetallic compound phases are characterized in detail. The growth rates of all forming phases follow a parabolic growth law even down to annealing times of only 27 s, verifying diffusion-controlled growth for the early stages. About 37% of the analyzed α/β interfaces were found to display near Kurdjumov-Sachs orientation relationships (misorientations > 5°), which predominantly corresponded more accurately to Bain or Nishiyama-Wassermann relationships (misorientations < 5°). Almost 60% of the investigated β/γ phase boundaries exhibit a cube-on-cube relationship. The δ phase, which is only stable above 560°C, undergoes an eutectoid decomposition during quenching, forming a lamellar structure of γ and ε phase. Almost all eutectoid ε has the same orientations as the initial adjoining ε grains. A considerable fraction of the eutectoid γ phase is oriented to the eutectoid ε phase according to the Potter and Burgers relationships. The solubilities of the Zn-rich phases δ and ε at 565°C and 580°C were found to exhibit systematically lower Zn concentrations than predicted by thermodynamic descriptions from literature and assessed Cu–Zn phase diagrams available in literature. • First extensive EBSD study on phase interfaces in Cu–Zn diffusion couples • Dominant orientation relationship at α/β is Bain instead of Kurdjumov-Sachs • 60% cube-on-cube orientation relationships between β/γ • Newly found Potter and Burgers relations between eutectoid γ+ε after decomposition of δ • Growth rate of all intermetallic Cu–Zn phases is parabolic even after 27 s of annealing
Authors
- R. Knechtel
- M. Seyring
- S. Lippmann
- K. Freiberg
- J. Möbius
Institutions
- Schott (Germany) (DE)
- Fraunhofer Institute for Applied Optics and Precision Engineering (DE)
- Schmalkalden University of Applied Sciences (DE)
- Friedrich Schiller University Jena (DE)
Publication Details
- Journal
- Journal of Alloys and Compounds
- Published
- 2025-12-24
- DOI
- https://doi.org/10.1016/j.jallcom.2025.185801
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00