Predictive Model for Epoxy‐Amine Polymerizations at Decreased Tc Using Variable Frequency Microwaves

ABSTRACT This study presents a predictive model for the thermo‐mechanical properties of epoxy polymers cured with Variable Frequency Microwave (VFM) processing. The model is based on properties derived from the structural features of the epoxide and amine precursors. The choices of total entropy, amine basicity, and total polarizability provide major processing advantages over conventional thermal polymerization methods. VFM lowers curing temperature (Tc) by up to 52% and cuts processing time in half. This lowered polymerization temperature preserves essential material properties such as ultimate glass transition temperature (Tg∞), minimized coefficient of thermal expansion, crosslink density, storage modulus, and average molecular weight between crosslinks.

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Publication Details

Journal
Journal of Applied Polymer Science
Published
2025-12-23
DOI
https://doi.org/10.1002/app.70244
Primary Topic
Epoxy Resin Curing Processes
Type
article
Field-Weighted Citation Impact
0.00

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article

Predictive Model for Epoxy‐Amine Polymerizations at Decreased Tc Using Variable Frequency Microwaves

Casey Check, Seok Hyun Lee, R. L. Hubbard
Journal of Applied Polymer Science
Epoxy Resin Curing Processes
article

Predictive Model for Epoxy‐Amine Polymerizations at Decreased Tc Using Variable Frequency Microwaves

Casey Check, Seok Hyun Lee, R. L. Hubbard
article en

Abstract

ABSTRACT This study presents a predictive model for the thermo‐mechanical properties of epoxy polymers cured with Variable Frequency Microwave (VFM) processing. The model is based on properties derived from the structural features of the epoxide and amine precursors. The choices of total entropy, amine basicity, and total polarizability provide major processing advantages over conventional thermal polymerization methods. VFM lowers curing temperature (Tc) by up to 52% and cuts processing time in half. This lowered polymerization temperature preserves essential material properties such as ultimate glass transition temperature (Tg∞), minimized coefficient of thermal expansion, crosslink density, storage modulus, and average molecular weight between crosslinks.

Journal of Applied Polymer ScienceVol. 143(11)
University of Oregon (US), Lambda Instruments (United States) (US)
University of Oregon
Openalex Percentile: Top 45%
Epoxy Resin Curing Processes
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