Gold( <scp>i</scp> ) alkoxide and thiolate complexes as potential atomic layer deposition precursors

Reactions of AuCl(PR<sub>3</sub>) with NaOC(CF<sub>3</sub>)<sub>3</sub> in the presence of 1 equiv. of Ag[BF<sub>4</sub>] or Ag[PF<sub>6</sub>] afforded the gold(I) alkoxide complexes [(Au{OC(CF<sub>3</sub>)<sub>3</sub>}{PR<sub>3</sub>})<sub><i>n</i></sub>] (R = Me (1), Et (2), <sup>i</sup>Pr (3) and <sup><i>t</i></sup>Bu (4)). In our hands, analogous reactions using NaO<sup><i>t</i></sup>Bu (for R = <sup>i</sup>Pr) did not yield a thermally robust product. However, the thiolate complexes [{Au(S<sup><i>t</i></sup>Bu)(PR<sub>3</sub>)}<sub><i>n</i></sub>] (R = Me (5) and <sup>i</sup>Pr (6)) were accessed by reaction of [{Au(S<sup><i>t</i></sup>Bu)}<sub><i>n</i></sub>] with PR<sub>3</sub>. Compound 1 is a trimer featuring linear Au{OC(CF<sub>3</sub>)<sub>3</sub>}(PMe<sub>3</sub>) units connected through unsupported aurophilic interactions, whereas more sterically hindered 3 and 4 are monomers in the solid state. Compound 5 is a dimer connected <i>via</i> an aurophilic interaction, while 6 is a monomer. In solution, 1 and 3 reacted almost instantly with HBpin or H<sub>3</sub>SiPh to afford metallic gold and volatile byproducts (free PR<sub>3</sub> and H<sub>2</sub> accompanied by {(F<sub>3</sub>C)<sub>3</sub>CO}Bpin or a mixture of {(F<sub>3</sub>C)<sub>3</sub>CO}SiH<sub>2</sub>Ph and {(F<sub>3</sub>C)<sub>3</sub>CO}<sub>2</sub>SiHPh). By contrast, analogous reactions with thiolate complex 5 required over 24 hours to reach completion. Complexes 1-4 melted at 105-106, 19-21, 59-61 and 181-183 °C, respectively, and sublimed cleanly between 50 and 80 °C at 5 mTorr. By contrast, 5-6 decomposed (completely or partially) during attempted sublimation at 5 mTorr; in the case of 5, decomposition was shown to occur <i>via</i> phosphine dissociation to re-form [{Au(S<sup><i>t</i></sup>Bu)}<sub><i>n</i></sub>]. Of the complexes in this work, 3 offers the best combination of thermal stability and volatility, and the relatively low melting point is attractive. However, 3 was ∼4% decomposed after 72 h at 85 °C, and ∼10% decomposed after 96 h at 100 °C, forming soluble [Au(P<sup>i</sup>Pr<sub>3</sub>)<sub>2</sub>][H{OC(CF<sub>3</sub>)<sub>3</sub>}<sub>2</sub>] (7), gold metal, and other insoluble product(s). Preliminary ALD reactor experiments using 3 (with a delivery temperature of 85 °C) and HBpin showed gold deposition at 124 °C, and no deposition was observed at this temperature using 3 without HBpin.

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Journal
Dalton Transactions
Published
2025-12-23
DOI
https://doi.org/10.1039/d5dt02836a
Primary Topic
Semiconductor materials and devices
Type
article
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article

Gold( i ) alkoxide and thiolate complexes as potential atomic layer deposition precursors

Nicholas A. Hoffman, David J. H. Emslie
Dalton Transactions
Semiconductor materials and devices
article

Gold( i ) alkoxide and thiolate complexes as potential atomic layer deposition precursors

Nicholas A. Hoffman, David J. H. Emslie
article en

Abstract

Reactions of AuCl(PR<sub>3</sub>) with NaOC(CF<sub>3</sub>)<sub>3</sub> in the presence of 1 equiv. of Ag[BF<sub>4</sub>] or Ag[PF<sub>6</sub>] afforded the gold(I) alkoxide complexes [(Au{OC(CF<sub>3</sub>)<sub>3</sub>}{PR<sub>3</sub>})<sub><i>n</i></sub>] (R = Me (1), Et (2), <sup>i</sup>Pr (3) and <sup><i>t</i></sup>Bu (4)). In our hands, analogous reactions using NaO<sup><i>t</i></sup>Bu (for R = <sup>i</sup>Pr) did not yield a thermally robust product. However, the thiolate complexes [{Au(S<sup><i>t</i></sup>Bu)(PR<sub>3</sub>)}<sub><i>n</i></sub>] (R = Me (5) and <sup>i</sup>Pr (6)) were accessed by reaction of [{Au(S<sup><i>t</i></sup>Bu)}<sub><i>n</i></sub>] with PR<sub>3</sub>. Compound 1 is a trimer featuring linear Au{OC(CF<sub>3</sub>)<sub>3</sub>}(PMe<sub>3</sub>) units connected through unsupported aurophilic interactions, whereas more sterically hindered 3 and 4 are monomers in the solid state. Compound 5 is a dimer connected <i>via</i> an aurophilic interaction, while 6 is a monomer. In solution, 1 and 3 reacted almost instantly with HBpin or H<sub>3</sub>SiPh to afford metallic gold and volatile byproducts (free PR<sub>3</sub> and H<sub>2</sub> accompanied by {(F<sub>3</sub>C)<sub>3</sub>CO}Bpin or a mixture of {(F<sub>3</sub>C)<sub>3</sub>CO}SiH<sub>2</sub>Ph and {(F<sub>3</sub>C)<sub>3</sub>CO}<sub>2</sub>SiHPh). By contrast, analogous reactions with thiolate complex 5 required over 24 hours to reach completion. Complexes 1-4 melted at 105-106, 19-21, 59-61 and 181-183 °C, respectively, and sublimed cleanly between 50 and 80 °C at 5 mTorr. By contrast, 5-6 decomposed (completely or partially) during attempted sublimation at 5 mTorr; in the case of 5, decomposition was shown to occur <i>via</i> phosphine dissociation to re-form [{Au(S<sup><i>t</i></sup>Bu)}<sub><i>n</i></sub>]. Of the complexes in this work, 3 offers the best combination of thermal stability and volatility, and the relatively low melting point is attractive. However, 3 was ∼4% decomposed after 72 h at 85 °C, and ∼10% decomposed after 96 h at 100 °C, forming soluble [Au(P<sup>i</sup>Pr<sub>3</sub>)<sub>2</sub>][H{OC(CF<sub>3</sub>)<sub>3</sub>}<sub>2</sub>] (7), gold metal, and other insoluble product(s). Preliminary ALD reactor experiments using 3 (with a delivery temperature of 85 °C) and HBpin showed gold deposition at 124 °C, and no deposition was observed at this temperature using 3 without HBpin.

Dalton TransactionsVol. 55(3)
McMaster University (CA)
McMaster University, Government of Ontario, Natural Sciences and Engineering Research Council of Canada
Openalex Percentile: Top 42%
Semiconductor materials and devices
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