Investigation of kinetics of ECM dendrite growth during corrosion in electronics

Corrosion-related failures are critical for electronics reliability in various technological sectors, with a wide range of systems shifting towards the use of high voltage and power. Miniaturization and high voltage between closely spaced connectors induce a higher risk of dendrite formation due to electrochemical migration (ECM) when connected by a condensed water film. Shorting caused by ECM dendrites is a prominent failure mechanism in electronics, which at higher voltage could even lead to incidents of fire. Dendrite growth occurs by metal dissolution and electric field assisted deposition, while dendrite composition and shorting characteristics are determined by the kinetics of growth, controlled by the current. To study the kinetic factors related to dendrite growth, a galvanostatic approach with applied current in the range of 0.5 µA to 5 mA was employed on a simple test PCB consisting of two copper pads. Electrochemical testing was supplemented by chemical analysis of dissolved species in a micro-volume of solution using ICP-OES, while characteristics of dendrite as a function of current levels were analyzed using XPS, SEM-EDS and TEM. Dendrite growth and pH gradient increased with current levels. Dendrite composition varied depending on the current levels, while it was suggested that hydrolysis reactions rate determined local pH and dendrite morphology rather than the level of copper dissolution (Total charge Q T /Charge consumed by Cu dissolution Q Cu >1 for low and high current levels with shorting). A complementary potentiostatic test verified this understanding of charge consumed (Q T / Q Cu >1 at 2 V and 48 V applied voltage, without dendritic shorting). • Pure water conductivity increases as copper and OH - ion production increases. • Dendritic growth rate increases with increase in applied current level. • Passed charge drives copper dissolution, hydrolysis and dendrite current upon shorting. • Dendrite morphology changes with increasing current. • Q T /Q Cu rises with higher applied current suggesting more charge used for hydrolysis.

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Publication Details

Journal
Corrosion Science
Published
2025-12-23
DOI
https://doi.org/10.1016/j.corsci.2025.113575
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
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article

Investigation of kinetics of ECM dendrite growth during corrosion in electronics

Jyothsna Murli Rao, Kapil Kumar Gupta, Anish Rao Lakkaraju, Rajan Ambat et al.
Corrosion Science
Electronic Packaging and Soldering Technologies
article

Investigation of kinetics of ECM dendrite growth during corrosion in electronics

Jyothsna Murli Rao, Kapil Kumar Gupta, Anish Rao Lakkaraju, Rajan Ambat, Feng Li
article en

Abstract

Corrosion-related failures are critical for electronics reliability in various technological sectors, with a wide range of systems shifting towards the use of high voltage and power. Miniaturization and high voltage between closely spaced connectors induce a higher risk of dendrite formation due to electrochemical migration (ECM) when connected by a condensed water film. Shorting caused by ECM dendrites is a prominent failure mechanism in electronics, which at higher voltage could even lead to incidents of fire. Dendrite growth occurs by metal dissolution and electric field assisted deposition, while dendrite composition and shorting characteristics are determined by the kinetics of growth, controlled by the current. To study the kinetic factors related to dendrite growth, a galvanostatic approach with applied current in the range of 0.5 µA to 5 mA was employed on a simple test PCB consisting of two copper pads. Electrochemical testing was supplemented by chemical analysis of dissolved species in a micro-volume of solution using ICP-OES, while characteristics of dendrite as a function of current levels were analyzed using XPS, SEM-EDS and TEM. Dendrite growth and pH gradient increased with current levels. Dendrite composition varied depending on the current levels, while it was suggested that hydrolysis reactions rate determined local pH and dendrite morphology rather than the level of copper dissolution (Total charge Q T /Charge consumed by Cu dissolution Q Cu >1 for low and high current levels with shorting). A complementary potentiostatic test verified this understanding of charge consumed (Q T / Q Cu >1 at 2 V and 48 V applied voltage, without dendritic shorting). • Pure water conductivity increases as copper and OH - ion production increases. • Dendritic growth rate increases with increase in applied current level. • Passed charge drives copper dissolution, hydrolysis and dendrite current upon shorting. • Dendrite morphology changes with increasing current. • Q T /Q Cu rises with higher applied current suggesting more charge used for hydrolysis.

Corrosion ScienceVol. 260
Technical University of Denmark (DK)
Openalex Percentile: Top 42%
Electronic Packaging and Soldering Technologies
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