Structure and Properties of Stainless Steel–Thermoplastic Joints Made Using Resistance Element Soldering Technology
This study investigated the microstructure and properties of soldered joints of AISI 304 stainless steel and PMMA thermoplastic or AW-1050A aluminum alloys made using Resistance Element Soldering (RES) technology. The bimetallic element used in RES provided a mechanical joint with a thermoplastic or aluminum alloy and a soldered joint with AISI 304 steel using Sn60Pb40 solder in the core of the element. The solder in combination with the Chemet CHM-A-014 flux wetted the AISI 304 steel surface very well at a temperature of 225 °C with a contact angle of 14°. During the production of the joints, the solder melted in the bimetallic element on the AISI 304 steel side, while solid solder was retained at the point of contact with the welding electrode. The strength of the joints ranged from 25.5 to 36.4 MPa, which was less than the strength of the solder, and the joints failed at the AISI 304 steel–Sn60Pb40 solder interface. The fracture surface was predominantly formed by the solder. An intermetallic phase of FeSn2 was identified at the interface.
Authors
- Alexander Schrek (ORCID: https://orcid.org/0000-0002-6971-8446)
- Branislav Vaňko (ORCID: https://orcid.org/0000-0003-2332-4991)
- Peter Gogola (ORCID: https://orcid.org/0000-0001-5046-4725)
- Pavol Sejč (ORCID: https://orcid.org/0000-0001-5298-4978)
- Zuzana Gábrišová (ORCID: https://orcid.org/0000-0003-3683-1220)
- Pavol Švec
- Miroslav Zelina
Institutions
- Slovak University of Technology in Bratislava (SK)
- University of Trnava (SK)
- Slovak Academy of Sciences (SK)
- Institute of Materials and Machine Mechanics of the Slovak Academy of Sciences (SK)
Publication Details
- Journal
- Metals
- Published
- 2025-12-20
- DOI
- https://doi.org/10.3390/met16010006
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Vedecká Grantová Agentúra MŠVVaŠ SR a SAV
- Slovenská technická univerzita v Bratislave