Thermal Characterization of a Stainless Steel Flat Pulsating Heat Pipe and Benchmarking Against Copper

Copper is widely used in two-phase devices for electronic cooling due to its ease of manufacture and high thermal conductivity. However, such high-heat conduction can limit the performance of pulsating heat pipes (PHPs) through transverse heat leakage. The use of lower-conductivity materials such as stainless steel enhances phase-change heat transfer by promoting stronger flow oscillations and reducing parasitic heat leakage, but it may be overall detrimental due to its poor thermal linkage between evaporator and condenser sections. Therefore, in this study, two main objectives are addressed: (i) experimentally characterizing the thermal behavior of a mini flat-plate PHP made of stainless steel (AISI 316L), and (ii) benchmarking its performance against a copper counterpart. Both devices were manufactured by diffusion bonding and tested under different orientations to evaluate operational robustness. The stainless steel PHP initiated oscillations at lower heat loads and showed larger temperature oscillations compared to the copper PHP, demonstrating effective phase-change heat transfer despite its lower thermal conductivity. A filling ratio of 71% of water provided the most stable operation, while orientation affected startup conditions and oscillation amplitude. Overall, stainless steel achieved comparable thermal performance to copper at low-to-moderate heat loads from 2.6 to 13.0 W/cm2, with additional benefits including reduced mass (~11% lighter), higher mechanical strength, and corrosion resistance. These results indicate that stainless steel is a viable alternative to copper at least for miniature flat-plate PHPs, offering a balance between thermal efficiency, mechanical robustness, and operational reliability.