Atomic Layer Deposition on Particulate Materials from 1988 through 2023: A Quantitative Review of Technologies, Materials, and Applications

Atomic layer deposition (ALD) is widely studied for numerous applications and is commercially employed in the semiconductor industry, where planar substrates are the norm. However, the inherent ALD feature of coating virtually any surface geometry with atomistic thickness control is equally attractive for coating particulate materials (supports). In this review, we provide a comprehensive overview of the developments in this decades-old field of ALD on particulate materials, drawing on a bottom-up and quantitative analysis of 799 articles from this field. The obtained dataset is the basis for abstractions regarding reactor types (specifically for particles), coating materials, reactants, supports and processing conditions. Furthermore, the dataset enables direct access to specific processing conditions (for a given material, surface functionality, application etc.) and increases accessibility of the respective literature. We also review fundamental concepts of ALD on particles and discuss the most common applications, i.e., catalysis (thermo-, electro-, photo-), batteries, luminescent phosphors and healthcare. Finally, we identify historical trends and provide an outlook on prospective developments.

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Publication Details

Journal
Chemistry of Materials
Published
2025-12-22
DOI
https://doi.org/10.1021/acs.chemmater.5c01919
Citations
6
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
4.38
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article

Atomic Layer Deposition on Particulate Materials from 1988 through 2023: A Quantitative Review of Technologies, Materials, and Applications

Riikka L. Puurunen, Aristeidis Goulas, Peter M. Piechulla, J. Ruud van Ommen et al.
6 citations
Chemistry of Materials
Semiconductor materials and devices
4.38
article

Atomic Layer Deposition on Particulate Materials from 1988 through 2023: A Quantitative Review of Technologies, Materials, and Applications

Riikka L. Puurunen, Aristeidis Goulas, Peter M. Piechulla, J. Ruud van Ommen, Mingliang Chen
article en
6 citations

Abstract

Atomic layer deposition (ALD) is widely studied for numerous applications and is commercially employed in the semiconductor industry, where planar substrates are the norm. However, the inherent ALD feature of coating virtually any surface geometry with atomistic thickness control is equally attractive for coating particulate materials (supports). In this review, we provide a comprehensive overview of the developments in this decades-old field of ALD on particulate materials, drawing on a bottom-up and quantitative analysis of 799 articles from this field. The obtained dataset is the basis for abstractions regarding reactor types (specifically for particles), coating materials, reactants, supports and processing conditions. Furthermore, the dataset enables direct access to specific processing conditions (for a given material, surface functionality, application etc.) and increases accessibility of the respective literature. We also review fundamental concepts of ALD on particles and discuss the most common applications, i.e., catalysis (thermo-, electro-, photo-), batteries, luminescent phosphors and healthcare. Finally, we identify historical trends and provide an outlook on prospective developments.

Chemistry of MaterialsVol. 38(1)
Metallurgical Research Institute (RO), Delft University of Technology (NL), Aalto University (FI)
Industry, innovation and infrastructure
Openalex Percentile: Top 5%
Semiconductor materials and devices
4.38
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