Shape optimized pin-fin heat sink design for efficient thermal management in microelectronics: A simulation-based approach supporting SDG-driven innovation

• Evaluates pin-fin heat sinks for efficient microelectronic cooling. • COMSOL modeling used to analyze square, circular, conical, and inverted fins. • Square fins achieved lowest thermal resistance and up to 96% fin efficiency. • Geometry strongly influences heat transfer; square fins improved it by 16%. • Findings provide design guidance for next-gen microelectronics cooling systems. Miniaturized electronics require efficient thermal systems to maintain optimal performance and long-term reliability. Microelectronic cooling relies heavily on pin-fin heat sinks because of their essential part in the process. This research evaluates the thermal characteristics of uniform-height pin fins with various shape designs from square to circular and onward to conical and inverted conical through COMSOL Multiphysics modeling. The research evaluates thermal resistance together with fin efficiency and Nusselt number, and heat conduction parameters. The simulation of electronic cooling required a free tetrahedral mesh structure combined with representative boundary conditions. Square pin fins displayed superior thermal performance compared to other shapes by showing the lowest thermal resistance from 0.01 to 0.03 K/W and reaching up to 96% fin efficiency. An increase of 16% in heat transfer emerged due to their highest Nusselt number measurement. The evaluation shows that pin fin geometry shapes determine heat sink efficiency, as square shapes offer the best performance in heat transfer and thermal delivery. The collected data expands upon existing studies about cylindrical and rectangular fins by presenting new knowledge about heat sink form factors. Replacement technology developments benefit from this research to address the rising cooling needs of electronic systems.