Machining of Silicon Carbide Plates with a Bonded Diamond Tool

This article examines the results obtained during coarse, fine, and finish grinding of polycrystalline and monocrystalline silicon carbide wafers using new types of bonded diamond tools with an organic binder and a new composition of cutting fluid (CF).

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Publication Details

Journal
Russian Microelectronics
Published
2025-10-01
DOI
https://doi.org/10.1134/s1063739725600761
Primary Topic
Advanced Surface Polishing Techniques
Type
article
Field-Weighted Citation Impact
0.00
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article

Machining of Silicon Carbide Plates with a Bonded Diamond Tool

Russian Microelectronics
Advanced Surface Polishing Techniques
article

Machining of Silicon Carbide Plates with a Bonded Diamond Tool

article en

Abstract

This article examines the results obtained during coarse, fine, and finish grinding of polycrystalline and monocrystalline silicon carbide wafers using new types of bonded diamond tools with an organic binder and a new composition of cutting fluid (CF).

Russian MicroelectronicsVol. 54(5)
Russian Federal Space Agency (RU), MIREA - Russian Technological University (RU)
Openalex Percentile: Top 49%
Advanced Surface Polishing Techniques
DOISourceOpenAlex
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Machining of Silicon Carbide Plates with a Bonded Diamond Tool · Russian Microelectronics (2025) | TGRS Research Map | TGRS