Impact of Various Core Materials on the Behavior of Through-Silicon via (TSV) Inductor in a DC/DC Converter

The paper discusses the design and modeling of a TSV-inductor for integration into an interleaved boost converter. The inductor features a topology of vertical TSV connected to rectangular horizontal connections, considering all parasitic effects from the various physical elements in the TSV-inductor. Using MATLAB software, different materials used in the TSV components are explored to enhance inductance values and quality factors, aiming to reduce energy losses. Validation of calculated electrical parameters from physical parameters and materials is done using TINA software through simulation of the interleaved boost converter circuit with the electrical circuit equivalent representation of the TSV-inductor.