Innovative Applications of μAM in High-Frequency Component Design: From 3D Structures to Coplanar Line Repair

Publication Details

Journal
SPIRE - Sciences Po Institutional REpository
Published
2025-09-16
Primary Topic
3D IC and TSV technologies
Type
article
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article

Innovative Applications of μAM in High-Frequency Component Design: From 3D Structures to Coplanar Line Repair

SPIRE - Sciences Po Institutional REpository
3D IC and TSV technologies
article

Innovative Applications of μAM in High-Frequency Component Design: From 3D Structures to Coplanar Line Repair

article en

Abstract

No abstract available for this paper.
SPIRE - Sciences Po Institutional REpository
Industry, innovation and infrastructure
Openalex Percentile: Top 47%
3D IC and TSV technologies
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Innovative Applications of μAM in High-Frequency Component Design: From 3D Structures to Coplanar Line Repair · SPIRE - Sciences Po Institutional REpository (2025) | TGRS Research Map | TGRS