Thermally Conductive Filler Particle Mixed Silicone Layer to Provide Heat Dissipation Functionality to c-Si Solar Cell Modules without Encapsulants

To ensure stable photovoltaic conversion performance, reducing the operating temperature of encapsulant-free solar cell modules (novel solar cell module). We have developed a method to improve heat dissipation in this novel solar cell module structure by using a high-density mixture of highly thermally conductive filler material in silicone, arranged in sheet form at the bottom substrate of the cell. In this study, we explored ways to improve heat dissipation: incorporating AlN particles, creating through-holes in the substrate, and filling these holes with silicone material. Additionally, an AlN/silicone layer was applied to curved modules with increased cell area, demonstrating the effectiveness of this approach.