Wire-Liftoff Lifetime Estimation Based on Thermal Fatigue Crack Growth: Proposal of Estimation Methodology Using Nonlinear Fracture Mechanics Parameter Δ<i>T</i>*

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Publication Details

Journal
Journal of The Japan Institute of Electronics Packaging
Published
2025-11-07
DOI
https://doi.org/10.5104/jiep.jiep-d-25-00061
Primary Topic
Fatigue and fracture mechanics
Type
article
Field-Weighted Citation Impact
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article

Wire-Liftoff Lifetime Estimation Based on Thermal Fatigue Crack Growth: Proposal of Estimation Methodology Using Nonlinear Fracture Mechanics Parameter ΔT*

Journal of The Japan Institute of Electronics Packaging
Fatigue and fracture mechanics
article

Wire-Liftoff Lifetime Estimation Based on Thermal Fatigue Crack Growth: Proposal of Estimation Methodology Using Nonlinear Fracture Mechanics Parameter ΔT*

article en

Abstract

No abstract available for this paper.
Journal of The Japan Institute of Electronics PackagingVol. 29(1)
Kagoshima University (JP), Kyushu University (JP), Saga University (JP), Kyoto University (JP), Kindai University (JP)
Openalex Percentile: Top 47%
Fatigue and fracture mechanics
DOISourceOpenAlex
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Wire-Liftoff Lifetime Estimation Based on Thermal Fatigue Crack Growth: Proposal of Estimation Methodology Using Nonlinear Fracture Mechanics Parameter Δ<i>T</i>* · Journal of The Japan Institute of Electronics Packaging (2025) | TGRS Research Map | TGRS