BGA Sn-Based Solder with Copper Powder Addition for Improved Reliability and Thermal Management

Publication Details

Journal
Zenodo (CERN European Organization for Nuclear Research)
Published
2025-10-13
DOI
https://doi.org/10.5281/zenodo.17338906
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
0.00
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article

BGA Sn-Based Solder with Copper Powder Addition for Improved Reliability and Thermal Management

Zenodo (CERN European Organization for Nuclear Research)
Electronic Packaging and Soldering Technologies
article

BGA Sn-Based Solder with Copper Powder Addition for Improved Reliability and Thermal Management

article en

Abstract

No abstract available for this paper.
Zenodo (CERN European Organization for Nuclear Research)
Openalex Percentile: Top 49%
Electronic Packaging and Soldering Technologies
DOIOpen Access PDFOpenAlex
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