Laser Processing of Gallium Oxide Crystals in the Preparation of Samples for Microelectronics

The paper presents the results of a study on an approach for sample preparation from bulk gallium oxide crystals using ablation laser cutting. The study was carried out using a «MicroSet» setup based on a fiber laser source with a wavelength of 1.064 μm and a power of 30 W. The possibility of processing material using a laser beam has been shown, the optimal trochoid width and pulse duration were selected, as well as the energy characteristics of the laser source and focusing optical system. The fundamental possibility of cutting gallium oxide crystals in different directions, regardless of the internal structure, the orientation of atoms and their bonds in the crystal lattice, has been shown.