Study of the Heat Transfer Characteristics of Porous Microjets Boiling in Heat Sinks

With the development of computer technology and the application of artificial intelligence, electronic chips are becoming increasingly miniaturized and integrated, leading to a rapid increase in their volumetric heating power, thus affecting their normal operation. To address this problem, a heat sink with an array of finned porous microjets was designed, and HFE-7100, which has good thermal stability and electrical insulation, was selected as the cooling medium. Through a combination of numerical simulations and experimental research, the influence of factors such as the longitudinal aspect ratio of the slotted fins, inlet subcooling, inlet volumetric flow rate, and jet Reynolds number on the heat transfer process of microjet boiling was investigated. The results showed that the optimized structure with an aspect ratio of 0.5 met the requirements of chip cooling and had a better cooling effect. In the single-phase convection heat transfer stage, under the same working condition, the inlet subcooling degree had little effect on heat transfer, and increasing the volume flow rate or jet Reynolds number could strengthen the convection heat transfer, and the maximum heat transfer coefficient could reach 15 724.40 W/(m²·K). However, in the jet boiling stage, the heat flux corresponding to the onset of nucleate boiling (ONB), and it decreased with a decrease in the inlet subcooling degree. Increasing the inlet volume flow rate or jet Reynolds number inhibited the occurrence of boiling, thus weakening the heat transfer. However, compared with the single-phase convective heat transfer stage, the heat transfer coefficient increased by 20.6%.