Foreword
On behalf of the IEEE ICMA 2025 Conference Organizing Committee, it is our great pleasure, an honor, and a privilege to welcome you to Beijing for the 2025 IEEE International Conference on Mechatronics and Automation. This conference reflects the growing interest in the broad research areas of mechatronics, robotics, sensors and automation.
Publication Details
- Published
- 2025-08-03
- DOI
- https://doi.org/10.1109/icma65362.2025.11120761
- Primary Topic
- Clay minerals and soil interactions
- Type
- article
- Field-Weighted Citation Impact
- 0.00