Package-Substrate Distributed Antenna with Shaped Beam for 5G Millimeter Wave Application

Integrated antenna technology is difficult to apply to 5G millimeter wave terminal due to the size restrictions of chip and package. In this paper, based on the idea of distributed antenna, a new design is proposed where Yagi antenna structure is adopted and distributed in the package and PCB substrate. Based on the working principle of Yagi antenna, the feeder is placed on package fabricated using LTCC processing technology, and the directors is placed on the PCB substrate. Thus, the PCB substrate structure is used to obtain a larger antenna aperture to effectively control the aperture field to shape the beam while reducing interconnection loss between package and PCB substrate to ensure radiation efficiency. According to different application scenarios, the same feeder on the package with different directors on the PCB substrates can obtain different performance such as gain and pattern, so as to achieve the effect of reusing the package. The simulation results show that the impedance bandwidth of the proposed distributed antenna is <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$26.5-29.5 \text{GHz}(10.7 \%)$</tex>, and a shaped beam with isoflux pattern. The proposed design has good feasibility and is a good candidate as 5G millimeter wave terminal antenna.