Multi-Objective optimization of electroplating parameters for low-passive intermodulation radio frequency connectors

• We propose a multi-objective optimization method for electroplating parameters to achieve the optimal combination of electroplating parameters for low-PIM connectors. • We investigate the effects of electroplating process parameters on connector PIM. • We establish an electroplating parameter optimization model that successfully obtains low-PIM connector configurations through multi-objective analysis. This paper proposes a multi-objective optimization method for electroplating parameters to achieve the optimal combination of electroplating parameters for low-PIM connectors. Firstly, the surface morphology of the connector was quantified by fractal theory, and the influence of electroplating parameters on the coating thickness and the fractal parameters of the coating surface was revealed by electroplating simulation. Secondly, the established RF connector coating was analyzed, including the surface microstates, equivalent circuit model, impedance and other electrical parameters were investigated to obtain the relationship between the RF connector PIM and the surface topography parameters of RF connector coating. Finally, by integrating a BP neural network with the NSGA-II algorithm to achieve multi-objective optimization of plating parameters, the optimal combination of plating parameters for low PIM connectors under various operating conditions was obtained. The results show that the electroplating parameters have regulatory properties on connector PIM, and through this multi-objective optimization method, the connector coating can be adjusted to achieve connector low-PIM.