New Figures of Conducted and Radiated Emissions of Electrical Power PCB With External Thermal Stress

This paper presents a synthetic state of challenging work to understand and prevent the real physical and electromagnetic noises and radiation issued from actual power chips devices used in mobile electric systems. A canonical Power PCB is realized to support comparative characterizations and modeling ways with different technology of power semiconductors. First, a global modeling procedure, mixing analytical and behavioral data and parameter definitions, is presented, so to validate a realistic simulation of electromagnetic disturbances. Then, we present experimental studies of temperature impacts on these electromagnetic emissions. That leads to the discussion of new cases of EM emissions and couplings with electronic devices used to control power and energy, especially in transportation and embedded systems.