Thermomechanical Buckling Analysis of Rectangular Piezoelectric Sandwich Microplates

This study investigates the thermomechanical buckling behavior of supported sandwich honeycomb rectangular microplates subjected to thermal loading and applied voltage. The structure comprises barium titanate piezoelectric face sheets and an aluminum honeycomb core. A high-order shear deformation theory is employed to formulate the displacement field. The governing equations are derived using the virtual displacement principle and solved via the Navier method. Parametric analysis evaluates the microplate aspect ratio, fiber orientation angle, length, face-to-core thickness ratio, and piezoelectric voltage influence on buckling behavior. Findings indicate that the critical buckling load decreases with increasing temperature, applied voltage, microplate length, thickness, and honeycomb cell angle.