Sub-THz Electrophysical Properties of Materials for 3D-Printing Radio Electronic Equipment Case

The article presents an analysis of the dielectric properties of materials in the sub-terahertz range used for fused deposition modeling 3D printing in the context of their applicability for the manufacture of electronic device cases. Parts of typical electronic equipment case G767, acrylonitrile styrene acrylate and acrylonitrile butadiene styrene filaments and extruded acrylonitrile styrene acrylate filament from granules were selected for the research. Optical microscopy was used to evaluate the homogeneity of the manufactured acrylonitrile styrene acrylate filament and measure its diameter. The frequency dependences of the complex permittivity of the elements of the radio electronic equipment cases and material samples were obtained by time-domain (100–1000 GHz) and continuous wave (115–258 GHz) spectroscopy. The linear absorption of materials from measurement of spectrum per pass is obtained. Comparative analysis of the electrophysical properties of equipment case and materials for 3D printing are presented. The investigated materials are suitable for radio electronic equipment cases operating in the sub-terahertz frequency range.