Homogeneous Multi-Chip PDN Optimization for DDR Memory Architecture Using RL

In this paper, we propose a reinforcement learning (RL)-based framework to address hierarchical feature variations, multi-chip interactions, and partial decoupling capacitor (decap) allocation across hierarchical power distribution network (PDN) levels, including the PCB, PKG, and chip domains. We formulate the problem as a multi-decap placement problem (MultiDPP), aimed at optimizing the location and allocation of decaps to achieve three critical objectives: minimizing PDN impedance, reducing cost, and optimizing chip area utilization. The RL framework employs a dual-reward mechanism combining a stepwise reward (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\boldsymbol{R}_{\text{step }}$</tex>) for immediate action evaluation and an episode-wise reward (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\boldsymbol{R}_{\boldsymbol{e p}}$</tex>) to achieve overall decap minimization. To validate the proposed approach, we apply it within a DDR5 environment, demonstrating significant reductions in design time, overall decap usage, and SSN compared with traditional methods. The results confirm that accounting for hierarchical differences and multi-chip interactions yields a robust, scalable solution for on-chip PDN design, paving the way for more efficient and reliable DIMM architectures in current and future memory technologies.

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Publication Details

Published
2025-08-18
DOI
https://doi.org/10.1109/emcsipi52291.2025.11169885
Primary Topic
Endometrial and Cervical Cancer Treatments
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Homogeneous Multi-Chip PDN Optimization for DDR Memory Architecture Using RL

Endometrial and Cervical Cancer Treatments
article

Homogeneous Multi-Chip PDN Optimization for DDR Memory Architecture Using RL

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Abstract

In this paper, we propose a reinforcement learning (RL)-based framework to address hierarchical feature variations, multi-chip interactions, and partial decoupling capacitor (decap) allocation across hierarchical power distribution network (PDN) levels, including the PCB, PKG, and chip domains. We formulate the problem as a multi-decap placement problem (MultiDPP), aimed at optimizing the location and allocation of decaps to achieve three critical objectives: minimizing PDN impedance, reducing cost, and optimizing chip area utilization. The RL framework employs a dual-reward mechanism combining a stepwise reward (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\boldsymbol{R}_{\text{step }}$</tex>) for immediate action evaluation and an episode-wise reward (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\boldsymbol{R}_{\boldsymbol{e p}}$</tex>) to achieve overall decap minimization. To validate the proposed approach, we apply it within a DDR5 environment, demonstrating significant reductions in design time, overall decap usage, and SSN compared with traditional methods. The results confirm that accounting for hierarchical differences and multi-chip interactions yields a robust, scalable solution for on-chip PDN design, paving the way for more efficient and reliable DIMM architectures in current and future memory technologies.

Korea Advanced Institute of Science and Technology (KR)
Affordable and clean energy
Openalex Percentile: Top 35%
Endometrial and Cervical Cancer Treatments
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