Research Progress in Flexible and Stretchable Encapsulation Materials for Electronics

Organic-based flexible and stretchable electronic devices have attracted attention as next-generation wearable technologies due to their high conformability to complex contours of the human body. To ensure their reliable operational lifetime remains a significant challenge, as these devices are inherently vulnerable to degradation by water vapor and oxygen in environment. To address this issue, the development of highly impermeable and stretchable encapsulation materials is essential. However, there is a trade-off relationship between stretchability and impermeability. In this review, recent advances in encapsulation technologies ranging from fundamental materials including polymers, metals, and oxides to the advanced structural approaches to achieve both high stretchability and water vapor barrier performance are discussed.

Publication Details

Journal
Journal of Flexible and Printed Electronics
Published
2025-06-01
DOI
https://doi.org/10.56767/jfpe.2025.4.1.15
Citations
1
Primary Topic
Eastern European Communism and Reforms
Type
article
Field-Weighted Citation Impact
4.20
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article

Research Progress in Flexible and Stretchable Encapsulation Materials for Electronics

1 citations
Journal of Flexible and Printed Electronics
Eastern European Communism and Reforms
4.20
article

Research Progress in Flexible and Stretchable Encapsulation Materials for Electronics

article en
1 citations

Abstract

Organic-based flexible and stretchable electronic devices have attracted attention as next-generation wearable technologies due to their high conformability to complex contours of the human body. To ensure their reliable operational lifetime remains a significant challenge, as these devices are inherently vulnerable to degradation by water vapor and oxygen in environment. To address this issue, the development of highly impermeable and stretchable encapsulation materials is essential. However, there is a trade-off relationship between stretchability and impermeability. In this review, recent advances in encapsulation technologies ranging from fundamental materials including polymers, metals, and oxides to the advanced structural approaches to achieve both high stretchability and water vapor barrier performance are discussed.

Journal of Flexible and Printed ElectronicsVol. 4(1)
Openalex Percentile: Top 5%
Eastern European Communism and Reforms
4.20
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