Stimuli-Responsive Debondable Adhesive for Sustainable Electronics

The increasing demand for electronic devices such as smartphones, tablets, and laptops has significantly intensified the generation of electronic waste. This waste stream includes not only valuable materials like precious metals and engineered plastics, but also hazardous substances that pose serious risks to the environment and human health. To address this growing issue, recycling and reuse of electronic components have gained importance as essential strategies for promoting resource efficiency and sustainability. However, one of the main challenges in device disassembly is the widespread use of strong adhesives that bond internal components tightly, especially within multilayered structures. These adhesives hinder clean separation and reduce the recovery rate of reusable materials. In recent years, debondable adhesive technologies that respond to external stimuli such as heat, light, electricity, and other physical or chemical triggers have attracted significant interest. These systems allow for selective and damage-free detachment of components, improving both environmental and economic outcomes. This review introduces recent advances in stimulus-responsive debondable adhesives, including photo, thermal, electrical, magnetic, solvent-based, ultrasonic, and bioinspired systems. These approaches offer promising pathways toward cleaner and more efficient disassembly, which is essential for building a circular and sustainable electronics industry.